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SAE AMS3690C

$42.50

Adhesive Compound, Epoxy Room Temperature Curing
standard by SAE International, 07/20/2009

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Description

This specification covers a two-component compound, an epoxy resin base and a hardener, in the form of a paste.

This adhesive compound has been used typically for non-structural bonding of metallic alloys and thermosetting plastics to themselves and to each other; it is intended primarily as an adhesive for electrical components nd devices operating at not higher than 185 \mDF (85 \mDC), but usage is not limited to such applications.

Product Details

Published:
07/20/2009
File Size:
1 file , 82 KB