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SAE AMS3692C

$42.50

Adhesive Compound, Epoxy Resing High Temperature Application
standard by SAE International, 08/14/2014

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Description

This specification covers a two-component adhesive compound, an epoxy resin base and a hardener, in the form of a paste.

This compound has been used typically for non-structural bonding of metals and thermosetting plastics, to themselves and to each other, and as an adhesive for electrical components and devices operating at not higher than 260 degrees C (500 degrees F), but usage is not limited to such applications.

Product Details

Published:
08/14/2014
File Size:
1 file , 110 KB