ADHESIVE FILM, HOT-MELT, ADDITION-TYPE POLYIMIDE For Foam Sandwich Structure, â55 to +230 Â°C (â65 to +450 Â°F) (Noncurrent: Jan 1993)
standard by SAE International, 01/01/1993
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This specification has been declared “NONCURRENT” by the Aerospace Materials Division, SAE, as of July, 1992.
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- 1 file , 500 KB