Potting Compound, Epoxy Bisphenol A-Type Filled, Heat Cure, High HDT
standard by SAE International, 09/22/2016
- PDF Format
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This specification covers an epoxy resin formulation supplied as a two-component system, requiring an oven cure for attainment of maximum properties.
- File Size:
- 1 file , 600 KB
- Redline File Size:
- 2 files , 2.8 MB